发明名称 Polyimide
摘要 A polyamic acid is herein disclosed which contains a structural unit represented by the formula [2a]20; n is an integer of 1 to 2; and R2 is an alkyl group or an alkoxy group having 1 to 20 carbon atoms. Furthermore, a polyamic acid composition is also disclosed which comprises the polyamic acid containing the structural unit represented by the formula [2a] and another polyamic acid containing a structural unit other than mentioned above. By heating the polyamic acid or the polyamic acid composition at a low temperature for a short time, a liquid crystal alignment film can be obtained which comprises a polyimide or a polyimide composition.
申请公布号 US5830976(A) 申请公布日期 1998.11.03
申请号 US19970906101 申请日期 1997.08.05
申请人 CHISSO CORPORATION 发明人 SUGIMORI, SHIGERU;KATOH, TAKASHI
分类号 C08G73/10;G02F1/1337;(IPC1-7):C08G75/00;C09K19/00 主分类号 C08G73/10
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