| 摘要 |
PROBLEM TO BE SOLVED: To prevent confusion of the signal transmission paths resulting from wire bonding regardless of the chip size by providing many wires which electrically connect a second wiring of a connecting member with a bonding pad of a semiconductor chip. SOLUTION: A semiconductor chip is mounted on and bonded to a chip attaching region 12a on a lowest surface of a ceramic substrate 12, a wiring 12c is formed by intaglio or relief engraving or a stepped surface 12b and electrically connected with an outer lead 12d which is projected from the semiconductor substrate 12. A connecting member 14 which is mounted on and attached to the surface 12b has a wiring 14a at the periphery to electrically connect with the wiring 12c of the surface 12b, and a through hole is formed in the central part. The wiring 14a of the connecting member 14 and bonding pad 20a of the semiconductor chip 20 are electrically connected respectively to one another. By the means confusion of the signal bath can be prevented. |
