| 摘要 |
<p>A thin thermosetting resin film that is amenable to being subjected to a debossing procedure that debosses a grooved printed circuit pattern thereon with minimal loss of debossment precision of the grooved pattern, which pattern and the grooving can be cured to produce a thermoset resin film that can be employed for eventually generating a printed board. The thermosetting resin film has the following qualities: a) it is designed for shaping by processes such as stamping, compression molding, transfer molding, injection molding, and the like without the need for constraining flow at the edges of the resin film; b) the resin is nonconductive, i.e., the resin can be used as a dielectric substrate; c) it is a thin film that is sufficiently uniform in thickness in order to provide consistent heat shaping capability across the breadth of the film, and the thickness should be sufficient to accept the shape imposed by the shaping process; d) the film possesses low flow over a broad temperature range so that it does not flow uncontrollably while undergoing cure conditions, and when placed under pressure, only the portions that are superimposed over a groove or cavity in the case of a female mold, or over a protuberance in the case of a male mold, will be caused to flow because of pressure imposed on the film; and e) the film gels or achieves properties similar to a state of gelation, over conditions leading to cure, that satisfy commercial conditions.</p> |
