| 摘要 |
1,039,414. Casing for a semi-conductor device. WESTINGHOUSE ELECTRIC CORPORATION. June 4, 1964 [July 5, 1963], No. 23272/64. Heading H1K. A hermetically sealed semi-conductor device comprises a cup-shaped support, a semi-conductor wafer disposed within the support, an insulating sleeve within the support whose circumferential surface conforms with the inner surface of the support, said sleeve being metallized and soldered to the support, and an electrical connector passing through the sleeve to contact the wafer. In a specific embodiment, Fig. 1, a copper support 14 has a silicon body 18 on the bottom thereof with two contact electrodes 22 and 24 and two solder preforms 42 and 44 on either side of the wafer 18. A copper electrode 36 passes through insulating member 26 and contacts the solder preform 42 at 40. A lead-tin solder is used to coat the insulator 26 at 46 where it meets the support 14 and also about the electrode 36 at 48. In another embodiment (Fig. 2, not shown), the inverted-cup shaped insulator 26 is replaced by a cylinder which houses a large diameter electrical conductor. The support may be Cu, Ag, Al, Fe or alloys thereof. The insulator may be ceramic or glass, e.g. steatite, alumina, cordierite, porcelain, and lead or lead-borate glass. The contact electrodes may be larger than the adjacent surface of the semi-conductor. Multielectrode devices may be also constructed. The device may be heat treated after assembly at 500-600‹ F., so that the various contacts may be consolidated. |
