A ball grid array package utilizes solder balls (14) having central cores of a material with a higher melting point than solder material surrounding the core. When the ball grid package (12) and motherboard assembly (10) are heated to the melting point of the solder material, the cores remain solid and function as spacers in preventing direct contact of the package surface and the motherboard surface, thus preventing molten solder from being squashed and flowing to adjacent ball contacts.
