BUFFER SOLUTIONS FOR SUSPENSIONS USED IN CHEMICAL-MECHANICAL POLISHING

摘要

The present invention relates to buffer systems in the form of solutions or the salts thereof for the production of suspensions that can be used in chemical-mechanical polishing. Said buffer systems can be particularly used in the production of suspensions with a high pH value ranging from 9,5 to 13. Said suspensions can be used for chemical-mechanical polishing of silicium and metal surfaces of semiconductors, i.e. wafers.