发明名称 |
METHOD FOR ELECTROPLATING METALLIC AND NON-METALLIC ENDLESS PRODUCTS AND DEVICE FOR CARRYING OUT SAID METHOD |
摘要 |
The invention relates to a method for electroplating metallic and non-metallic endless products with metals or alloys by means of a continuous process using aprotic electrolytes free of water and oxygen. Said method is characterized in that the endless product is directed via a lock system (1) into a shielded electroplating installation placed under an inert-gas atmosphere, where the following steps are carried out at temperatures 120 ~C: activating the endless product to be electroplated; rinsing the endless product to be electroplated; contacting the endless product to be electroplated; electroplating the endless product to be electroplated with metal or a metal alloy; drying the electroplated endless product; and delivering the electroplated endless product from the installation via a lock system. The invention also relates to a device for carrying out this method.
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申请公布号 |
CA2287179(A1) |
申请公布日期 |
1998.10.29 |
申请号 |
CA19982287179 |
申请日期 |
1998.04.15 |
申请人 |
ALUMINAL OBERFLACHENTECHNIK GMBH |
发明人 |
HELLER, JOERG;DE VRIES, HANS |
分类号 |
C25D3/44;C25D7/06;(IPC1-7):C25D7/06 |
主分类号 |
C25D3/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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