Heat-producing component to circuit board contacting method

摘要

The method involves attachment of the heat-producing chip (1) to the board (2) with the interposition of a flexible film (3) folded across its centre so as to provide contact surfaces with patterns of solder points for both chip and board. The upper half of the film is first placed in contact with the underside of the chip. The lower half is then bonded electrically and mechanically to the circuit board. The film is advantageously transparent so as to allow visual inspection of the solder joints.