发明名称 PROCESS AND APPARATUS FOR THE TREATMENT OF FLAT-FORM MATERIAL, ESPECIALLY OF PRINTED CIRCUIT BOARDS
摘要 <p>In a process and an apparatus for the treatment of flat-form material, especially of coated printed circuit boards (1), wherein the printed circuit boards (1) are subjected to various treatment processes in succession, such as airflow treatment, drying, cooling and the like, while they are being transported through a housing (7) in which the various treatment processes are carried out, there are provided in the housing (7), for the purpose of improving control of the process and increasing the adaptability of the treatment installation, individual treatment zones (12, 13, 14) separate from one another, and the printed circuit boards (1) are conveyed into the individual treatment zones (12, 13, 14) in groups, a separate treatment process being carried out in each treatment zone.</p>
申请公布号 WO1998048601(A1) 申请公布日期 1998.10.29
申请号 EP1998002020 申请日期 1998.04.07
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