发明名称 |
Verfahren zum Herstellen einer Sensorbaugruppe sowie Sensorbaugruppe |
摘要 |
The invention relates to a sensor module with a plastic base part (2) which has an area for accommodating the sensor (8), said accommodating area being provided with sensor connections (13), and a connection area (6), said connection area being provided with plug connections (14). The inventive sensor module also has a sensor element (16) with electrical contacts which are connected to the sensor connections electroconductively. A printed circuit board (18), fixed onto the base part (2), provides the electrical connection between the sensor element (16) and the plug connections (14).
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申请公布号 |
DE19717348(A1) |
申请公布日期 |
1998.10.29 |
申请号 |
DE19971017348 |
申请日期 |
1997.04.24 |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
BAUER, HANS-PETER, 93047 REGENSBURG, DE |
分类号 |
B60R16/02;B60R16/023;G01P1/02;H05K5/00;(IPC1-7):H05K13/00;H05K7/02;G01P15/00 |
主分类号 |
B60R16/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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