发明名称 Verfahren zum Herstellen einer Sensorbaugruppe sowie Sensorbaugruppe
摘要 The invention relates to a sensor module with a plastic base part (2) which has an area for accommodating the sensor (8), said accommodating area being provided with sensor connections (13), and a connection area (6), said connection area being provided with plug connections (14). The inventive sensor module also has a sensor element (16) with electrical contacts which are connected to the sensor connections electroconductively. A printed circuit board (18), fixed onto the base part (2), provides the electrical connection between the sensor element (16) and the plug connections (14).
申请公布号 DE19717348(A1) 申请公布日期 1998.10.29
申请号 DE19971017348 申请日期 1997.04.24
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 BAUER, HANS-PETER, 93047 REGENSBURG, DE
分类号 B60R16/02;B60R16/023;G01P1/02;H05K5/00;(IPC1-7):H05K13/00;H05K7/02;G01P15/00 主分类号 B60R16/02
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