BALL GRID ARRAY PACKAGE ASSEMBLY INCLUDING STAND-OFFS

摘要

A ball grid array package (12) utilizes stand-offs having central cores of a material with a higher melting point than solder material surrounding the core. When the ball grid package and motherboard assembly (10) are heated to the melting point of the solder material, the stand-off cores (24) remains solid and function as spacers in preventing direct contact of the package surface and the motherboard surface, thus preventing molten solder balls (14) from being squashed and flowing to adjacent ball contacts.