发明名称 |
Integral copper column withsolder bump flip-chip |
摘要 |
The present invention includes an integral copper column with a solder bump flip chip. An integrated circuit chip is provided having an electrical circuit and including at least two contact pads. A thin layer of barrier metallization is provided over the contact pads. A support substrate is provided having a circuit layer with raised features that include copper traces. A solder bump connects the contact pad on the integrated circuit chip and the raised features of the flex circuit to provide an integral copper column with a solder bump flip chip. |
申请公布号 |
GB2317268(B) |
申请公布日期 |
1998.10.28 |
申请号 |
GB19970016867 |
申请日期 |
1997.08.11 |
申请人 |
* PACKARD HUGHES INTERCONNECT CO |
发明人 |
CHRIS M * SCHREIBER;BAO * LE |
分类号 |
H01L23/485;H01L23/498;H05K3/20;H05K3/34;H05K3/40;(IPC1-7):H01L23/498;H01L23/367 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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