发明名称 |
SILICON NITRIDE CIRCUIT BOARD AND SEMICONDUCTOR MODULE |
摘要 |
There is provided a semiconductor module which comprises a high thermal conductive silicon nitride substrate 10 having a thermal conductivity of 60 w/m.k or more, a semiconductor element 7 mounted on this high thermal conductive silicon nitride substrate 10, metal circuit plates 3 which are bonded on the semiconductor element-mounted side of this high thermal conductive silicon nitride substrate 10 and single metal plate 4a which is bonded to a side opposing to the semiconductor element- mounted side of this high thermal conductive silicon nitride substrate and is bonded on an apparatus casing 9 or a mounting board. By this constitution, there can be provided a semiconductor module having a simple structure, which can be miniaturized, and having an improved structure strength and an excellent heat cycle resistance property without requiring a heat sink plate or the like. <IMAGE> |
申请公布号 |
EP0874399(A1) |
申请公布日期 |
1998.10.28 |
申请号 |
EP19970935820 |
申请日期 |
1997.08.19 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KOMORITA, HIROSHI;IKEDA, KAZUO;KOMATSU, MICHIYASU;SATO, YOSHITOSHI;NABA, TAKAYUKI |
分类号 |
H01L23/15;H01L23/373 |
主分类号 |
H01L23/15 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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