| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electroconductive adhesive capable of preventing defective bonding from occurring when bonding a printed circuit board, etc., to a semiconductor chip, etc., therewith and to provide both an electronic device and a method for producing the electronic device. SOLUTION: This electroconductive adhesive 1 contains electroconductive particles 7, having elasticity such as a polystyrene latex and dispersed in an adhesive 6 such as an epoxy resin. A surface provided with a bump 5 on a semiconductor chip 4 is bonded to a surface equipped with a wiring 3 on a printed circuit board 2 with the electroconductive adhesive 1, which is then cured to bring the electroconductive particles 7 into pressure contact with the wiring 3 and bump 5. Thereby, an electronic device is produced. |
