| 摘要 |
A heat dissipating fan/integrated circuit assembly includes a connector mounted on a printed circuit board and having two protrusions respectively projecting outwardly from two opposite sides thereof, an integrated circuit securely mounted to an upper side of the connector thereof, a fin mounted to an upper side of the integrated circuit, a fan device mounted on top of the fin and including two slots defined therein, and two engaging members respectively extending through the associated slots. Each engaging member includes an engaging hole defined in a lower end thereof for releasably engaging with the associated protrusion of the connector. An elastic member is mounted between each engaging member and the fan device to bias the associated engaging member away from the fan device, thereby providing a secure engagement between each protrusion and the associated engaging hole.
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