发明名称 |
Method of cooling electronic devices using a tube in plate heat sink |
摘要 |
A method of cooling electronic devices in an electronic assembly is proposed where the said assembly has at least one board that houses electronic modules. The methodology comprises shaping a light weight plate with apertures as to compliment the geometric shape of the assembly and board to be cooled; affixing coolant passage tubes in the apertures of the plate and finally cooling the electronic assembly by placing the assembly in thermal contact with the plate and passage tubes after a coolant is introduced in the passages.
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申请公布号 |
US5826643(A) |
申请公布日期 |
1998.10.27 |
申请号 |
US19960660248 |
申请日期 |
1996.06.07 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GALYON, GEORGE TIPTON;KEMINK, RANDALL GAIL;SCHMIDT, ROGER RAY |
分类号 |
H01L23/473;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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