发明名称 |
Clamping mechanism for a bonding apparatus |
摘要 |
A bonding apparatus provided with a clamping device for holding a workpiece such as a tab tape, comprising an upper clamper and a lower clamper which are respectively divided into two sections. The upper and lower clampers are respectively mounted on an upper clamper holding plate and a lower clamper holding plate so that the gaps between facing surfaces of the respective sections of the clampers can be adjusted.
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申请公布号 |
US5826778(A) |
申请公布日期 |
1998.10.27 |
申请号 |
US19960754978 |
申请日期 |
1996.11.22 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
SATO, KOJI;IDE, JUNICHI;SONODA, YUKITAKA |
分类号 |
H01L21/60;H01L21/603;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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