发明名称 Clamping mechanism for a bonding apparatus
摘要 A bonding apparatus provided with a clamping device for holding a workpiece such as a tab tape, comprising an upper clamper and a lower clamper which are respectively divided into two sections. The upper and lower clampers are respectively mounted on an upper clamper holding plate and a lower clamper holding plate so that the gaps between facing surfaces of the respective sections of the clampers can be adjusted.
申请公布号 US5826778(A) 申请公布日期 1998.10.27
申请号 US19960754978 申请日期 1996.11.22
申请人 KABUSHIKI KAISHA SHINKAWA 发明人 SATO, KOJI;IDE, JUNICHI;SONODA, YUKITAKA
分类号 H01L21/60;H01L21/603;(IPC1-7):H01L21/60 主分类号 H01L21/60
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