| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a printed-wiring board in which ruggedness in a wiring part is relaxed and whose electric characteristic is good by a method wherein a dummy pattern is formed in a desired cutting part near a part in which an insulating layer is made thin and whose electric insulation cannot be ensured. SOLUTION: Copper foils 2 are added to both faces of a glass epoxy board 1, dry films are laminated on the copper foils 2, and a conductor circuit pattern 3 and a dummy pattern 4 are formed in desired parts. When the dummy pattern 4 is formed, ruggedness on an insulating film 6 near the circuit pattern 3 is relaxed, and the flat insulating film 6 is formed. In succession, a catalyst is given to the insulating film 6, the catalyst is activated, and a copper-plated layer 8 is formed by an electroplating operation. Lastly, a conductor circuit pattern 9 is formed on the copper-plated layer 8, and a conductor part 8 is covered with an insulating resin 10. Thereby, it is possible to obtain a printed- wiring board which prevents a crack from being generated due to the formation of a through hole and whose electric characteristic can be enhanced. |
