发明名称 DIELECTRIC ISOLATION SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent reduction of an element breakdown voltage. SOLUTION: A silicon active layer 2 is formed on an oxide film 2 buried in a silicon substrate 1. The silicon active layer 3 is formed therein with a trench which reaches the buried oxide film 2, the trench is formed with a side wall oxide film 6, and the remaining part of the trench is filled with polycrystalline silicon. When the silicon active layer 3 has a thickness tSI and a distance from the trench to a p-n junction 8 is set to be Liso, a relation of Liso>(√2.tSI)/2 is satisfied.
申请公布号 JPH10289948(A) 申请公布日期 1998.10.27
申请号 JP19970096847 申请日期 1997.04.15
申请人 TOSHIBA CORP 发明人 YAMAGUCHI YOSHIHIRO
分类号 H01L29/73;H01L21/331;H01L21/76;H01L21/762;H01L27/12;H01L29/732;(IPC1-7):H01L21/762 主分类号 H01L29/73
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