发明名称 THIN FILM ELEMENT AUTOMATIC LAPPING METHOD AND DEVICE THEREOF
摘要 PROBLEM TO BE SOLVED: To correctly measure a value of resistance, and to improve the working accuracy, by converting a value of resistance of a monitor element into the height of a thin film element, and stopping the lapping work by a lapping machine, in response to the reaching of the height of the thin film element to a target value. SOLUTION: When a value of resistance of a working monitor resisting element (ELG element) of a rover 101, becomes a specific value, the working is stopped. The stopping of the lapping work is performed by stopping a lapping machine. An unload cylinder 120 is operated when the value of resistance of the working monitor becomes the specific value, to project an unload block 121. Whereby an adaptor 11 is rotated around a support part 110a, to separate a work 103 from the lap surface plate 104. That is, the lap working is immediately stopped when the value of resistance of the working monitor becomes the specific value. Whereby the accuracy in size of the work can be improved. Further by installing the adaptor 11, the unloading can be easily performed.
申请公布号 JPH10286766(A) 申请公布日期 1998.10.27
申请号 JP19970092479 申请日期 1997.04.10
申请人 FUJITSU LTD 发明人 SUGIYAMA YUICHI;WATANUKI KIICHI;YOKOI KAZUO;YANAGIDA YOSHIAKI;SUDO KOJI
分类号 B24B37/013;B24B37/07;B24B49/02;G11B5/31 主分类号 B24B37/013
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