| 摘要 |
PROBLEM TO BE SOLVED: To enable acquisition of a sufficient junction width for a sealed part to thereby improve a sealing reliability even when a heat treatment is required at the time of sealing a cavity cap. SOLUTION: In an electronic-part mounting step, electronic parts including a semiconductor acceleration sensor chip are mounted in a cavity of a package body with use of silicon die bonding material and silicon silver paste. Thereafter, in a baking step S5, the package body having the electronic parts mounted therein is heated to a baking temperature of about 380 deg.C±5 deg.C. In a sealing step S6, sealing material made of glass with low melting point is provided between the peripheral edge of the cavity of the package body and a cap. Under this condition, the package body is heated to join the package body to the cap with use of the sealing material. The heating temperature of the package body is set at about 365 deg.C+5 deg.C lower than the baking temperature in the baking step S5.
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