| 摘要 |
PROBLEM TO BE SOLVED: To obtain an etching soln. with which the surface of a polyamide resin can be etched so that a metal film can be formed thereon by electroless plating with a high adhesiveness by specifying the compounding ratio of an inorg. acid to formic acid in the soln. SOLUTION: At least one acid selected from among hydrochloric, sulfuric, nitric, and phosphoric acids is used as the inorg. acid, and the amt. of it incorporated is 1.5-6.0 mol/l. The amt. of formic acid incorporated is 1.0-10 mol/l. The etching temp. of a polyamide resin with the soln. can be suitably set depending on the type of a polyamide resin being etched, the compsn. of an electroless plating bath used, etc., for instance, in the range of 20-50 deg.C. When an immersion process is adopted, the immersion time can be in the range of 1-30 min. A polyamide resin suitable to be etched with the soln. is a ring-opening polymer made fromε-caprolactam, etc., such as nylon 6 or nylon 11. |
