| 摘要 |
PURPOSE:To eliminate the crack of a package, the deformation of a wire and the like and to enhance reliability by a method wherein an interconnection pattern formed on a resin cap and a semiconductor chip are connected directly by using a bump, the semiconductor chip is not covered with a resin for mounting use or it is covered with a low-stress resin for mounting use and it is mounted and sealed. CONSTITUTION:A semiconductor chip 3 is housed inside a recessed part 1a of a cap 1; bumps 4 formed on one face are connected to interconnection patterns 2 via inner connection parts 5. That is to say, the chip 3 and the interconnection patterns 2 of the cap 1 are connected via the bumps 4, and no bonding wire is used at all. A board 6 is connected to the interconnection patterns 2 via outer connection parts 7. The recessed part 1a is not filled with a resin or the like. Since the chip 3 is not covered with a resin, no interface which stores moisture exists even when the cap 1 made of a resin absorbs moisture. Consequently, a package is not cracked even when a thermal stress is exerted when it is mounted on a printed-circuit board. |
