发明名称 CUTTING DEVICE
摘要 PROBLEM TO BE SOLVED: To realize smooth cutting by rationally disposing equipment necessary for executing each process in a cutting device to execute a cutting process and a marking process. SOLUTION: Two frames A, B capable of running are placed on rails 1a. On the first frame A, a processing carriage 7 on which a laser torch 8 is mounted and a marking carriage 11 on which a marking torch 10 is placed are provided to be capable of travelling transversely, and a control panel 12 and a laser oscillator 5 are placed. On the second frame B, a dust collector 16 and a cooling unit 17 are placed. On the dust collector 16, a duct 18 having an opening 18a of such a length as to face a laser torch 8 to be disposed on lower surfaces of the first and the second frames is installed. The laser oscillator 5 and the cooling unit 17 are connected to each other by a hose 19. In the case of executing a cutting process, the frames A, B are integrated with each other, and in case of executing a marking process, the second frame B is retracted.
申请公布号 JPH10286731(A) 申请公布日期 1998.10.27
申请号 JP19970090745 申请日期 1997.04.09
申请人 KOIKE SANSO KOGYO CO LTD 发明人 NAKANO ETSUO;KARUMAI TAKEHIKO;KUROSAWA FUKUYOSHI;TANOWAKI TAKESHI;MORIKI TATSUYA
分类号 B23P23/00;B23K7/00;B23K7/10;B23K9/32;B23K10/00;B23K26/00;B23K26/08;B23K26/16;B23K37/02 主分类号 B23P23/00
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