| 摘要 |
<p>PROBLEM TO BE SOLVED: To solder a plurality of components to one chip carrier so as to be adjacent to each other with respectively different types of solder materials by a method wherein a different solder material fusion prohibiting structure such as a recess or a protrusion is provided in the area of the chip carrier to which components are soldered and the chip carrier consists of only one component. SOLUTION: A chip carrier 3 is composed of a conductor 1 which is the material of the chip carrier 3, two component soldering parts 4 and 5 and one recess (recessed trench) 2 which is a different solder material fusion prohibiting structure and providing between the soldering parts 4 and 5. The recess 2 has a square or U-shaped cross-section. The conductor 1 is so machined as to have a shape having the soldering parts 4 and 5 with required areas and heights and the recess 2. With this constitution, the different types of solder materials are not mixed and the safe soldering work can be carried out.</p> |
