发明名称 POLISHING DEVICE FOR SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To form a polishing device compact to be installed in a narrow space, and improve convenience for transport and maintenance. SOLUTION: A first frame 10a on which a polishing table 16 having a polishing tool 48 on an upper surface is installed, and a second frame 10b on which a top ring device 12 having a rotatable top ring head 24 to hold a substrate while pressing a subject surface of the substrate to be polished to a polishing table 16 with a prescribed pressure is installed are composed as separate bodies. The first frame 10a and the second frame 10b are stacked on a base frame 10d in order to be assembled.</p>
申请公布号 JPH10286761(A) 申请公布日期 1998.10.27
申请号 JP19970110150 申请日期 1997.04.11
申请人 EBARA CORP;TOSHIBA CORP 发明人 ITO KENYA;AIZAWA HIDEO;YAJIMA HIROMI;SHIGETA KENICHI;TATEYAMA YOSHIKUNI
分类号 B23Q37/00;B24B37/00;B24B41/02;(IPC1-7):B24B37/00 主分类号 B23Q37/00
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