发明名称 |
POLISHING DEVICE FOR SUBSTRATE |
摘要 |
<p>PROBLEM TO BE SOLVED: To form a polishing device compact to be installed in a narrow space, and improve convenience for transport and maintenance. SOLUTION: A first frame 10a on which a polishing table 16 having a polishing tool 48 on an upper surface is installed, and a second frame 10b on which a top ring device 12 having a rotatable top ring head 24 to hold a substrate while pressing a subject surface of the substrate to be polished to a polishing table 16 with a prescribed pressure is installed are composed as separate bodies. The first frame 10a and the second frame 10b are stacked on a base frame 10d in order to be assembled.</p> |
申请公布号 |
JPH10286761(A) |
申请公布日期 |
1998.10.27 |
申请号 |
JP19970110150 |
申请日期 |
1997.04.11 |
申请人 |
EBARA CORP;TOSHIBA CORP |
发明人 |
ITO KENYA;AIZAWA HIDEO;YAJIMA HIROMI;SHIGETA KENICHI;TATEYAMA YOSHIKUNI |
分类号 |
B23Q37/00;B24B37/00;B24B41/02;(IPC1-7):B24B37/00 |
主分类号 |
B23Q37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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