| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the subject composition, capable of manifesting a high polishing rate while suppressing the damage to a metallic surface such as aluminum, copper or tungsten and useful for chemomechanical polishing of a wafer, etc., by including a specific microcellulose as a polishing agent therein. SOLUTION: This composition contains preferably 0.1-10 wt.% microcellulose, having <=8μm average particle diameter and containing <=40% particles having >=10μm particle diameter (e.g. the one obtained by carrying out the depolymerizing treatment of a cellulosic material such as a wood pulp or a purified linter according to the acid hydrolysis, alkali oxidative decomposition, enzymolysis or steam explosion decomposition, providing a cellulose having 30-375 average polymerization degree, as necessary, performing the purification such as washing with water, then applying a mechanical shear and wet grinding the resultant material).</p> |
