| 摘要 |
PROBLEM TO BE SOLVED: To suppress increase in the plane size caused by the run off protective resin in the side face direction by a method wherein a run-off suppressing members of resin is provided between a substrate having an inner lead connecting to an electrode through the intermediary of a device hole and an integrated circuit device on the side having no electrode at all. SOLUTION: The sides a and c of an integrated circuit device 2 are connected to a film carrier 1 through the intermediary of inner leads 4 but not connected to the sides b and d having no electrode at all. Next, protrusions 10 as flow control members are provided to be positioned between the integrated circuit device 2 and the film carrier 1 on the sides b and d. The level of these protrusions 10 is made similar to the levels of the inner leads 4 and the bumps 5 junctioned with one another for mounting the integrated circuit device 2 on a carrier tape. Through these procedures, the upper side of the protrusions 10 comes into contact with the surface opposite to the integrated circuit device 2 so that the running off of a protecting resin from the sides b, d may he suppressed by the protrusions 10. |
