| 摘要 |
PROBLEM TO BE SOLVED: To form a package without bringing a metal mold into contact onto a chip at low cost without losing, simpleness and reliability, in a resin sealed semiconductor package. SOLUTION: A protective film 21 is formed on the surface on the side of a semiconductor chip 2 where a chip electrode 3 is formed, and continuously, an opening hole part 21a is formed on the protective film 21. Continuously, a conductive ball 1 comprising solder, etc., acting as an external connecting terminal, is fit into the opening hole part 21a, and connected to the chip electrode 3. Continuously, the entire surface of the semiconductor chip 2 and the entirety of the conductive ball 1 are covered and sealed with a resin. And then the resin surface of the side where the conductive ball 1 is formed is polished, to expose the conductive ball 1 from the resin surface. Thereby an external connecting terminal is formed without bringing a metal mold into contact with the chip electrode 3 in a resin sealing process, so that the chip electrode 3 is prevented from breaking, etc., and deterioration of reliability is prevented. |
