首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
WOODY COMPOSITION BOARD AND ITS MANUFACTURE
摘要
申请公布号
JPH10286805(A)
申请公布日期
1998.10.27
申请号
JP19970097161
申请日期
1997.04.15
申请人
EIDAI CO LTD
发明人
KAMISAKA TERUYOSHI
分类号
B27D1/04;B32B21/02;B32B21/13;E04C2/16;(IPC1-7):B27D1/04
主分类号
B27D1/04
代理机构
代理人
主权项
地址
您可能感兴趣的专利
ULTRASONIC PROBE AND ITS MANUFACTURING METHOD
TARGET EQUIPMENT IN COMPLIANCE WITH HAVI STANDARD
ACOUSTIC SURFACE WAVE ELEMENT AND COMMUNICATION APPARATUS
PORTABLE TERMINAL DEVICE AND INCOMING CALL PROCESSING METHOD THEREOF
PORTABLE TERMINAL
INFORMATION EXCHANGE SYSTEM AND ELECTRONIC KEY MANAGEMENT SYSTEM
REMOTE CONTROL UNIT, CONTROL APPARATUS, AND REMOTE CONTROL SYSTEM
PHOTOCURRENT PROCESSING CIRCUIT AND CURRENT AMPLIFYING CIRCUIT USED THEREFOR
ORGANIC ELECTROLUMINESCENT ELEMENT
SUBSTRATE LAYER USED TOGETHER WITH SEMICONDUCTOR PACKAGE AND ITS FORMING METHOD
ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE EQUIPPED WITH ORGANIC THIN FILM TRANSISTOR, AND ITS MANUFACTURING METHOD
HIGH DENSITY PLASMA CHEMICAL VAPOR DEPOSITION APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT USING IT
MULTIPLE WAVELENGTH SEMICONDUCTOR LASER ELEMENT
IMAGE FORMING APPARATUS AND ELECTRONIC APPARATUS
SUBSTRATE PROCESSING SYSTEM
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
SEMICONDUCTOR EPITAXIAL WAFER AND SEMICONDUCTOR DEVICE CUT THEREFROM
TEST UNIT OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
METHOD AND APPARATUS OF ULTRASONIC PACKAGING ELECTRONIC PART
PROBE CARD AND PROBER, PROCESS FOR FABRICATING SEMICONDUCTOR DEVICE