| 摘要 |
PROBLEM TO BE SOLVED: To obtain a phenol resin adhesive, quick curable at a low temperature, having a slight formaldehyde odor of a product after molding and capable of manifesting good adhesion even to a coniferous material. SOLUTION: This phenol resin adhesive is obtained by compounding a resol type phenol resin prepared by condensing phenols with aldehydes in the presence of a basic catalyst with an epoxy resin powder having 60-100 deg.C softening point. An imidazole compound as a curing agent for the epoxy resin in an amount of 0.05-5 wt.% based on the epoxy resin is preferably compounded therewith. |
