发明名称 Device for the electrolytic treatment of plate-shaped workpieces
摘要 PCT No. PCT/EP95/04473 Sec. 371 Date May 15, 1997 Sec. 102(e) Date May 15, 1997 PCT Filed Nov. 14, 1995 PCT Pub. No. WO96/15294 PCT Pub. Date May 23, 1996The plate-shaped workpieces (W) are conducted through a treatment cell (BZ) containing a treatment bath in vertical attitude on a horizontal conveying path with the assistance of contacting and conveying means, the end walls of said treatment cell having vertical slots for the passage of the workpieces (W). The bath liquid emerging from the treatment (BZ) is collected in a collecting tank and is returned such into the treatment cell (BZ) with the assistance of a pump that an at least largely vertical flow direction (SR) derives at both sides of the conveying path. The bath liquid is diverted toward the surface of the workpieces (W) with guide devices (LV) arranged at both sides of the convoying path in the treatment cell (BZ). An improved ion exchange in the region of the workpieces (W) is effected by the guide devices (LV). In, for example, the electrolytic treatment of printed circuit boards, the metal deposition can thus be undertaken with high current densities. The guide devices (LV) are thereby arranged such that they form a guide for the workpieces. As a result thereof, thin, flexible printed circuit boards can also be particularly treated. The guidance of workpieces (W) with different formats and heights likewise presents no difficulties.
申请公布号 US5827410(A) 申请公布日期 1998.10.27
申请号 US19970836625 申请日期 1997.05.15
申请人 SIEMENS S.A. 发明人 HOSTEN, DANIEL
分类号 H05K3/18;C25D5/08;C25D7/00;C25D17/00;H05K3/00;H05K3/24;(IPC1-7):C25D17/00 主分类号 H05K3/18
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