| 摘要 |
PROBLEM TO BE SOLVED: To simplify the internal interconnections of memory chips while maintaining a large capacity by a method, wherein at least a part of interconnections between a plurality of the memory chips are formed on a module board on which a plurality of the memory chips are mounted. SOLUTION: A memory module 10 is constituted by the COB mounting of a plurality of memory bare chips 1 on a module board 2. Interconnections between the respective memory bare chips 1 are formed on the module board 2, instead of a main board. With this constitution, instead of conducting a part of multilayer interconnections on the memory chips 1 formed on the module board 2, the interconnections on the respective memory bare chips 1 can be simplified in comparison with the case where the total capacity which is the summation of the respective capacities of the memory bare chips 1 is realized by a single memory chip. Further, the quantity of interconnections in the main board can be substantially reduced, in comparison with the case that the memory bare chips 1 mounted on the module board 2 are individually mounted on the main board. |
