| 摘要 |
PROBLEM TO BE SOLVED: To prevent the inclination of an island at the time of resin sealing, when the thermal distribution of a semiconductor chip becomes uniform with a supporting lead having the structure serving a fixed-potential lead at the same time. SOLUTION: Supporting leads 22 are arranged at the both sides of an island 11, so that the leads are extending from one end part of a package to the other end part and support both ends of the island 11. To these supporting leads 22, the fixed-potential electrodes of a semiconductor chip 13 are connected to these supporting leads 22 with bonding wires 14. One end of this supporting lead 22 is positioned at the outside of the line of outer-lead parts 12b as a structure identical to the outer lead part 12b. |
