| 摘要 |
PROBLEM TO BE SOLVED: To prevent peeling of an interlayer insulating film which is to be caused by a dicing means by a method wherein, before a dicing process, the adjacent part of a light-emitting and receiving part at the end of a chip region is eliminated which part corresponds to prearranged dicing lines in at least the chip short side direction of the interlayer insulating film. SOLUTION: For example, in the case that an interlayer-insulating film is a laminated film of a first and a second interlayer-insulating films 13, 31, a second interlayer-insulating film 31 of a region is eliminated before an isolating process which region is a part corresponding to prearranged dicing lines L1, L2 in at least the chip short side direction in a region where the dicing means passes and adjacent to a light-emitting and receiving part of chip regions I, II ends. Thereby the second interlayer-insulating film 31 in the region adjacent to the light-emitting and receiving part in at least the chip regions I, II ends is not cut by a dicing means. Peeling of the second interlayer insulating film 31, which is caused by the dicing means in the vicinity of the light-emitting and receiving part can be prevented. Abnormality of form of the light-emitting and receiving part of a chip end can be prevented. |
