| 摘要 |
PROBLEM TO BE SOLVED: To enable a heat sink to be mounted in a part mounting surface and also in an opposite side in a condition that a power module and the other electronic parts are mounted on the same surface of a substrate, by opening a hole in a mounting space, of the power module on the circuit substrate. SOLUTION: A dual line type power module 21 is mounted in a substrate 23 provided with a hole 25, a heat sink 22 is brought into contact through the hole 25 from an opposite side to a mounting surface of the dual line type power module 21. By a mounting screw 24, the dual line type power module 21 and the heat sink 22 are fixed. An input/output terminal 27 of the dual line type power module 21 is bent in the director opposite to the mounting surface so as to position a radiating surface 26 in an opposite side to the hole 25, and the dual line type power module 21 and the heat sink 22 can be also arranged in the same surface to the substrate. |
