发明名称 BACKING MATERIAL FOR PROBE AND MANUFACTURE FOR ULTRASONIC PROBE AND ULTRASONIC PROBE USING THE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a backing material for probes which fully absorbs ultrasonic waves emitted from a rear face of a piezoelectric element, thereby preventing reflection, serves also to take out an electrode, achieves sure electric connection and enhances workability and, an ultrasonic probe using the material. SOLUTION: A plurality of bamboo blind-like metallic thin plates having many unit conduction electrodes 8 extended from a coupling part 7 are disposed in parallel in a backing material 3. The coupling part of the bamboo blind-like metallic thin plates is exposed to a surface of the backing material. Extended end parts of the unit conduction electrodes are exposed or projected to an outer surface except for the surface of the backing material. The backing material 3 for probes is constituted in this manner. A piezoelectric plate is fixed onto the surface of the backing material, which is divided in a first dimensional and a second-dimensional directions.
申请公布号 JPH10282074(A) 申请公布日期 1998.10.23
申请号 JP19970098312 申请日期 1997.03.31
申请人 NIPPON DEMPA KOGYO CO LTD 发明人 TAWARA YOSHIHIRO;SHIMIZU YASUO
分类号 G01N29/24;A61B8/12;H04R17/00 主分类号 G01N29/24
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