IC HEAT DISSIPATING STRUCTURE,申请号JP19970082781-传众专利搜索

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发明名称	IC HEAT DISSIPATING STRUCTURE
摘要
申请公布号	JPH10284650(A)	申请公布日期	1998.10.23
申请号	JP19970082781	申请日期	1997.04.01
申请人	SONY CORP	发明人	ITO FUMIHIRO
分类号	H01L23/36;(IPC1-7):H01L23/36	主分类号	H01L23/36
代理机构		代理人
主权项
地址

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