METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To efficiently provide a semiconductor device from a substrate from which many devices are to be manufactured and to provide that device as a high-reliability product. SOLUTION: Concerning a method for producing semiconductor device constituted by mounting semiconductor chips 12 on a substrate 20 and sealing the semiconductor chips by resin, this method includes a process for mounting the plurality of semiconductor chips 12 on a substrate 20 corresponding to a plurality of unit substrates 20a which are formed on the substrate 20, a process for filling the substrate 20 inward from the outer peripheral parts with sealing resin 16 so as to seal the semiconductor chips 16 by resin, and a process for providing a plurality of resin sealed semiconductor devices by cutting the resin sealed substrate 20 into unit substrates together with the sealing resin 16.