| 摘要 |
<p>PROBLEM TO BE SOLVED: To avoid damage to a thin type wafer in a series of work processes, by, after polishing the wafer integrated with a protective member from its rear surface side, detecting a street on the wafer's rear surface with an infrared ray alignment unit, and dicing from the rear surface of the wafer. SOLUTION: A wafer body integrated with a protective member is polished from its rear-surface side into a specified thickness, then, a chuck table 13 sucking the wafer body is transported to a cassette 15. From the cassette 15, the wafer body is transported one by one, and transported to a chuck table 57. The wafer body sucked/held with the chuck table 57 is positioned directly under an alignment unit 58, and a pattern matching is performed with the alignment unit 58 for alignment of a street which partitions a chip formed on the surface of wafer W (cutting line) with a cutting means 59 which cuts the street, and the street of the wafer W is cut from its rear surface for dicing.</p> |
