| 摘要 |
<p>PROBLEM TO BE SOLVED: To have a high degree planarity and softness and simultaneously keep structural completeness of a contact of a device for coming into contact with a chip pad on a wafer by comprising a Z-axis member unit which can include an elastomer as occasion demands and can be reused softly. SOLUTION: A burn-in apparatus 6 comprises a base unit 7, a soft and selectively conductive Z-axis member 8, a laminate type wafer level contact sheet 9, etc. The base unit 7 has a high planarity structure and is disposed on a wafer 1 and extends exceeding one of wafers or a plurality of edges. The selectively conductive member 8 gives electric contact between a first terminal 13 of the base unit 7 and a contact pad 20 on a laminate type wafer level contact sheet 9. As described above, the contact sheets of a burn-in base unit and a wafer level are electrically connected to each other if a soft reusable Z-axis member unit is disposed therebetween.</p> |
