| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor package on which the mounting density and the mounting efficiency of a substrate can be improved, in addition to the accomplishment of testing and improved wiring after mounting on the substrate. SOLUTION: An outer lead terminal 3 is arranged on the side face part of a package substrate 2 where an LSI chip 1 is mounted, and a pad-grid array terminal 6, having a protruding electrode 9, is arranged on the backside of the package substrate 2. By having a constitution, wherein the outer output terminal of a semiconductor package 11 is supported by the outer lead terminal 3 and the pad grid array terminal 6, the reduction of the pitch between each terminal can be suppressed, and mounting quality can be improved. Also, the number of testing pads can be reduced by conducting a test which utilizes the outer lead terminal 3, and the high density mounting on a mounting substrate 21 can be accomplished.</p> |
