| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device, wherein the electric contact with the socket terminal of a function inspecting device is good and an outer lead having the tip shape without damaging the socket terminal is provided, and the manufacturing method of this semiconductor device. SOLUTION: In a semiconductor device, wherein a semiconductor element, a package 1 containing this semiconductor element and an outer lead 2 extending to the outside of this package are provided, an inclined face or a curved face 2a which is covered with a solder layer and whose thickness decreases toward the tip is formed at the lower surface or the like of the tip part of the outer lead 2 having a gull-wing shape. The inclined face or the curved face 2a of the tip of the outer lead 2 is formed by forming a tapered groove, covering the face with a solder layer 3, cutting the outer lead at the groove-forming past or the like.</p> |
