| 摘要 |
<p>PROBLEM TO BE SOLVED: To form electrodes on the same surface, and connect them to a circuit board without using a lead wire by forming another region of the same conductivity type as that of the region exposed to the surface, and enabling the connection of electrodes at the surface via another region. SOLUTION: For example, an epitaxial layer 2 of the same conductivity type and high specific resistance is made on a silicon semiconductor substrate 1 of N-conductivity type and a low specific resistance. A first electrode 5 is in contact with the epitaxial layer 2, and a Schottky barrier 3, which is the junction between metal and a semiconductor, is made at the contact part. Moreover, a third region 7 of N-conductivity type and low specific resistance, which extends and the surface to the substrate 1, is made at the epitaxial layer 2. Then, a second electrode 6 is connected to the region 7. Moreover, bumps 8 and 9 for performing the face-down bonding are made of the electrode 5 and the electrode 6, respectively. This way, the electrode 5 and the electrode 6 lie both on the identical surface of the epitaxial layer 2, that is, on the surface of the semiconductor substrate.</p> |
