A novel tin-based solder alloy contains greater than 0 and <= 3.5 wt.% Sb, 0-3.0 wt.% Ag and a predetermined amount of a property-improving first and/or second additive. Preferably, the first additive consists of greater than 0 and <= 1.0 wt.% each of Cu and/or Ni and the second additive consists of greater than 0 and <= 1.0 wt.% each of P and/or Ge. Also claimed is a novel tin-based solder alloy containing greater than 0 and <= 4.0 wt.% Ag and greater than 0 and <= 2.0 wt.% Cu and/or greater than 0 and <= 1.0 wt.% Ni, optionally together with greater than 0 and <= 1.0 wt.% each of P and/or Ge.
