发明名称 |
Method to improve adhesion of a thin submicron fluoropolymer film on an electronic device |
摘要 |
The present invention comprises a substrate having at least one of metal, alloy, or semiconductor features with an insulative fluoropolymer dielectric layer bonded thereto through the use of silane coatings, and a method of manufacture. |
申请公布号 |
AU6249898(A) |
申请公布日期 |
1998.10.22 |
申请号 |
AU19980062498 |
申请日期 |
1998.01.27 |
申请人 |
W.L. GORE + ASSOCIATES INC. |
发明人 |
C. THOMAS ROSENMAYER |
分类号 |
B05D5/08;H01L21/312;H01L21/768;H01L23/532 |
主分类号 |
B05D5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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