COOLING DEVICE FOR AN ELECTRONIC MODULE

摘要

The invention relates to a cooling device for an electronic module. The electronic module has a sealed, predominantly metallic housing, said housing being used at least partially for cooling the electrical components in the electronic module (8). The electronic module (8) is accomodated together with its housing in a cooling case (1; 30; 34, 35). This cooling case (1; 30; 34, 35) has a supply connection (2; 27) and a discharge channel (6) for a coolant. The electronic module (8) is positioned in the cooling case (1; 30; 34, 35) in such a way that the coolant, preferably the cooling oil for the aggregate controlled by the electronic module, flows around most of said electronic module (8).