发明名称 WIRING BOARD HAVING VIAS
摘要 A wiring board in which vias radially extending through the wiring board from one side to the other side in such a way that the interval between the vias on one side of the wiring board is smaller than those between the vias on the other side, characterized in that a plurality of vias (12, 12, ...) are radially arranged from one side (10a) of the wiring board (10) to the other side (10b) in such a way that the interval (Wa) between the vias on one side (10a) is smaller than the interval (Wa) between the vias on the other side (10b) in order to prevent electrical short-circuit even if the interval between the vias on one side of the wiring board is very small, and that a conductor forming a core portion (14) of each of the vias (12) is covered with a sheath portion (16) made of an insulator.
申请公布号 WO9847326(A1) 申请公布日期 1998.10.22
申请号 WO1998JP01746 申请日期 1998.04.16
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD.;HORIUCHI, MICHIO;SUYAMA, TOSHIAKI;TOKITA, MASAKUNI 发明人 HORIUCHI, MICHIO;SUYAMA, TOSHIAKI;TOKITA, MASAKUNI
分类号 H05K3/44;H01L23/498;H05K1/11;H05K3/40;H05K3/46;(IPC1-7):H05K1/11 主分类号 H05K3/44
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