| 发明名称 |
Solder precise positioning method for semiconductor chip fixing to circuit board |
| 摘要 |
<p>The method is applied to a flat chip (1) secured to the circuit board (20) with a screen-printed or preform solder blob (9) containing solid particles (10) of higher melting point. The soldering takes place in a chamber (30) filled with antioxidant gas and sealed (11) around the edge of a cover (3) on a hotplate (4). The chamber is evacuated (V1) and the cover is slowly lowered, pressing the chip into the liquid solder. The latter is then solidified within 10 s by injection of coolant gas.</p> |
| 申请公布号 |
DE19649458(A1) |
申请公布日期 |
1998.10.22 |
| 申请号 |
DE1996149458 |
申请日期 |
1996.03.14 |
| 申请人 |
D-TECH GMBH ANTRIEBSTECHNIK UND MIKROELEKTRONIK, 33689 BIELEFELD, DE |
发明人 |
GABRIEL, RUPPRECHT, 33689 BIELEFELD, DE |
| 分类号 |
B23K1/008;H01L21/60;H01L23/488;(IPC1-7):H01L21/58;H05K3/34;B23K35/24 |
主分类号 |
B23K1/008 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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