| 摘要 |
A slurry distribution system (10) for distributing slurry to a polishing machine (90, 92, 94) that polishes a semiconductor wafer is disclosed. The slurry distribution system (10) includes a storage tank (24, 26) for storing the slurry, a mixing device (30, 32) for mixing the slurry in the storage tank (24, 26), a distribution loop with an inlet and outlet in fluid communication with the storage tank, a valve in fluid communication with the distribution loop (70) for dispensing the slurry to the polishing machine, and a pump (34, 36, 38) for circulating the slurry from the storage tank through the distribution loop (70) and into the storage tank regardless of whether the slurry is dispensed to the polishing machine (90, 92, 94). In this manner, the slurry is agitated and efficiently used during polishing and during intervals between polishing.
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